LOC semiconductor assembled with room temperature adhesive

ABSTRACT

A method of making a semiconductor device assembly having a lead frame and a semiconductor device configured to be attached to each other is disclosed. An adhesive is applied at room temperature through a stencil to the lead frame. The semiconductor device is urged against the adhesive to effect the attachment between the semiconductor device and the lead frame. The adhesive preferably is from about 75 percent to about 95 percent isobutyl acetal diphenol copolymer and from about 25 percent to about 5 percent, respectively, of titanium oxide.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a division of application Ser. No. 09/339,718, filedJun. 24, 1999, now U.S. Pat. No. 6,316,823 B1, issued Nov. 13, 2001,which is a continuation of application Ser. No. 09/177,000, filed Oct.22, 1998, now U.S. Pat. No. 5,959,347, issued Sep. 28, 1999, which is adivisional of application Ser. No. 08/916,977, filed Aug. 14, 1997, nowU.S. Pat. No. 5,840,598, issued Nov. 24, 1998.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates to the manufacture of semiconductor deviceassemblies and, more particularly, to methods of assembly ofsemiconductor devices using room temperature adhesives and to theassembled semiconductor device and lead frame using room temperatureadhesives.

2. State of the Art

To manufacture a semiconductor device assembly, a semiconductor device,typically called a die or chip, is typically attached to a lead frame. Alead frame is a structure having a plurality of leads, bus bars, orother connecting structure to be electrically connected with thesemiconductor device. In a conventional lead frame, the lead frameincludes a die paddle to which the semiconductor device is attached anda plurality of leads extending inwardly to surround the periphery of asemiconductor device mounted on the die paddle. Subsequently, aplurality of wire bonds are made to connect the bond pads on the activesurface of the semiconductor device to the ends of the leads extendingaround the periphery of the semiconductor device. In a leads-over-chiptype lead frame (LOC lead frame), the lead frame is formed having no diepaddle and having a plurality of leads which extends over the activesurface of the semiconductor device being secured thereto to support thesemiconductor device, with a plurality of wire bonds being formedbetween the bond pads on the active surface of the semiconductor deviceand the ends of the leads of the lead frame.

A conventional lead frame or LOC lead frame may serve other functions.That is, it may assist in heat dissipation during manufacture, increasethe structural strength of the assembled semiconductor device as well asprovide convenient locations to make electrical connections.

In order to attach the semiconductor device to the lead frame, differentadhesives and adhesively coated tapes have been suggested. For example,U.S. Pat. No. 5,304,582 (Ogawa) shows use of adhesive tape withdifferent adhesives on opposite sides for attaching a die to a leadframe. U.S. Pat. No. 5,548,160 (Corbett et al.) discloses use ofadhesives including adhesives that have a core.

Typically, in attaching a LOC lead frame to a semiconductor device, adouble-coated adhesive tape is applied between the active surface of thesemiconductor device and the lead frame. The adhesive tape is typicallyan insulating carrier with a polymer adhesive on both sides tomechanically interconnect the lead frame and the semiconductor device.The tape composition and the amount of polymer adhesive used on the tapevaries with the size of the semiconductor device. It is desired to usethe least amount of adhesively coated tape to attach a semiconductordevice to a lead frame to attempt to minimize problems. Too much polymeradhesive added to the tape can cause a coefficient of thermal expansionmismatch between the lead frame, the polymer adhesive and thesemiconductor device which can contribute to the failure of the packageddevice. Reducing the size of the tape to enhance performance may involvereprocessing the tape at some increased cost and at some difficulty forthe smaller sizes.

If an adhesive, as opposed to an adhesively coated tape, is used toattach the semiconductor device to the lead frame, the quantity ofadhesive must be carefully controlled in the dispensing process. Thebond time for the adhesive is recognized to be difficult to control andcan vary greatly with variations in adhesive viscosity, adhesiveapplication temperature and amount of adhesive used. Further, adhesivecan bleed from under the lead finger and interfere with the attachmentof other lead fingers of the lead frame. Also, use of an adhesive (atelevated temperatures) may also lead to a nonuniform bond line betweenthe semiconductor device and the lead frame. That is, the semiconductordevice is not generally in alignment with the lead frame, causingdifferent spacings to be present between the lead fingers and the bondpads on the active surface of the semiconductor device, therebyaffecting wire bonding operations. Additionally, uneven application ofadhesive or non-uniform adhesive viscosity can lead to tilting of thesemiconductor device relative to the lead frame. An uneven or tiltedrelationship has been determined to be a factor that reducessemiconductor device assembly quality and leads to failures.

Therefore, an adhesive with better qualities suitable for direct bondingof the semiconductor device to the lead fingers of a lead frame isdesirable.

BRIEF SUMMARY OF THE INVENTION

A semiconductor device assembly is formed by joining a lead frame and asemiconductor device. The lead frame includes a plurality of leadfingers, each lead finger having a lower attaching surface for adhesiveattachment to portions of the active surface of a semiconductor device.

A non-conductive polymer adhesive is selected from the group ofadhesives that is tacky and compliant at room temperature, easilyapplied to a substrate, such as through the use of a stencil, and easilycured to a predetermined degree. The non-conductive polymer is appliedat room temperature, either to the lower surface of the lead fingers ofthe lead frame or to portions of the active surface of the semiconductordevice for compression therebetween. The lead fingers are connected bywire bonds to the bond pads on the active surface of the semiconductordevice.

The adhesive preferably has a first copolymer material selected from thegroup of copolymers that includes isobutyl compounds and a secondmaterial that is from a group of metal oxides that includes titaniumdioxide. Preferably, the first material is isobutyl acetal diphenolcopolymer. More preferably, the second material is titanium dioxide.

In a preferred composition, the adhesive has about 75 percent to about95 percent of isobutyl acetal diphenol copolymer and, respectively, fromabout 25 percent to about 5 percent of titanium dioxide.

Methods of assembling the semiconductor device assembly includeproviding a lead frame and a semiconductor device. A non-conductivepolymer adhesive is selected from the group that is tacky and compliantat room temperature and is applicable to a substrate through a stencil.The adhesive is applied to one of the semiconductor device and a surfaceof the lead frame at room temperature. The lead frame and thesemiconductor device are urged together at room temperature to attachthe semiconductor device to the lead frame and with electricalconnections between the lead fingers of the lead frame and the bond padson the active surface of the semiconductor device made by wire bondsextending therebetween.

In the preferred methods of assembly, the adhesive may be from thegroups of adhesives as described hereinbefore.

In an alternate configuration, a stencil is provided with the adhesive,at room temperature, applied to either a surface of each lead finger ofthe lead frame or portions of the active surface of the semiconductordevice. The lead frame and the semiconductor device are thereafterpositioned relative to each other and urged together to effectattachment and electrical connection, if desired.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

In the drawings which illustrate what are regarded as the best modes andpreferred embodiments for carrying out the invention:

FIG. 1 is a perspective simplified illustration of a semiconductordevice assembly of the invention;

FIG. 2 is a perspective simplified illustration of a semiconductordevice assembly of the invention with a stencil for applying adhesive;

FIG. 3 is a cross sectional depiction of portions of a semiconductordevice of the invention; and

FIG. 4 is a cross sectional depiction of portions of a semiconductordevice assembly of the invention with the semiconductor device and thelead frame in contact.

DETAILED DESCRIPTION OF THE INVENTION

Referring to drawing FIG. 1, a semiconductor device assembly 10 includesa lead frame 12 having a plurality of lead fingers 14 thereon. The leadframe 12 is one of a plurality that is connected in end-to-end fashion,thereby forming a strip or roll of lead frames. That is, lead frame 12is positioned between a preceding frame 16 and a following frame 18. Thelead frame 12 as well as the preceding frame 16 and following frame 18are driven or moved through a manufacturing environment by anappropriate drive or indexing system that engages the apertures 20formed in the opposite edges or rails 22 and 24. At a convenient time,the lead frames 12, 16 and 18 are separated one from the other and theopposite edges or rails 22 and 24 are removed so that each frame with asemiconductor device attached thereto becomes a separate and useablesemiconductor device assembly.

Each lead frame 12 is formed having a plurality of lead fingers 14, eachlead finger 14 having a lower surface, i.e., an undersurface orattaching surface 26. In some instances, the bond pads 36 of thesemiconductor device 34 may include bumps thereon to mate with each ofthe lead fingers 14 of the lead frame 12.

As illustrated in drawing FIG. 1, the semiconductor device 34 is anysuitable semiconductor device configured for attachment to the leadframe 12. The semiconductor device 34 has portions, bond pads 36, on theactive surface thereof configured for electrical connection to the leadfingers 14 of a lead frame 12. As illustrated, the semiconductor device34 has a plurality of bond pads 36 thereon, all suitably positioned sothat, upon proper positioning of the semiconductor device 34 withrespect to the lead fingers of a lead frame, the bond pads 36 areavailable for further connection. The semiconductor device 34 may alsohave additional bond pads thereon.

Adhesive 40 is used to attach the lead frame 12 and the semiconductordevice 34 together. As shown in FIG. 1, the adhesive 40 may be appliedin a line or in a plurality of beads positioned for effecting attachmentof the semiconductor device 34 to the attaching surface 26 of the leadfingers 14 of the lead frame 12.

In operation, the adhesive 40 is preferably applied to an attachingsurface 26 of the lead fingers 14 of the lead frame 12. That is, theadhesive 40 is positioned on the attaching surface by any appropriatenozzle, roller, glue gun tip or the like. Upon urging the semiconductordevice 34 and the lead frame 12 together, the adhesive 40 is compressedand spread horizontally to effect an attachment. Since the adhesive ispreferably at room temperature, viscosity and flow is typically constantthroughout the adhesive. In turn, the risk of an uneven relationshipbetween the semiconductor device and the lead frame is reduced as thesemiconductor device and lead frame are assembled. Further, applicationat room temperature of the adhesive reduces heat induced failures in thesemiconductor device and lead frame assembly arising during the assemblyoperations.

As illustrated in drawing FIG. 2, the lead frame 60 is the same as leadframe 12. The lead frame 60 is positioned to pass relative to a stencil62. That is, a drive or indexing means (not shown) urges the lead frame60 as well as the preceding frame 64 and the following frame 66 to movepast the stencil 62. A source 67 of adhesive 68 is illustrated separatefrom the stencil 62 for clarity. In normal use, the stencil 62 ispositioned so that adhesive 68 from the source 67 is urged through theapertures 70 of the stencil 62 (by, for example, a piston) and onto theunderside or attachment surface 72 of the lead frame 60. The stencil 62may be configured with any desired pattern of apertures for depositionof adhesive 68 on an attaching surface 72 of the lead frame 60. Ofcourse, the adhesive may also be deposited on the active surface 73 ofthe semiconductor device 76.

The source 67 with stencil 62 and adhesive 68 may move up and downrelative to the attaching surface 72 to apply the adhesive 68 thereto.An anvil block 74 may be positioned opposite the stencil 62 so that thelead frames 60, 64 and 66 are all properly supported upon movement ofthe stencil 62 in close proximity and upon operation of the source 67 tourge the adhesive 68 outwardly to and in contact with the attachingsurface 72. A similar anvil block may be positioned so that the leadframe 60 is supported upon movement of the semiconductor device 76 intocontact with the adhesive on the attaching surface 72 of the lead frame60 and further upon compression of the adhesive 68 as the active surface73 of the semiconductor device 76 is urged toward the attaching surface72 of the lead frame 60. As the active surface 73 of the semiconductordevice 76 comes into contact with the attaching surface 72, bond pads78, 80 and 82 located on the active surface 73 of the semiconductordevice 76 are positioned to effect electrical connection withcorresponding lead fingers 60′ of the lead frame 60 as desired usingwire bonds.

Referring to drawing FIG. 3, a semiconductor device 34 is illustrated inrelation to the lead fingers 14 of a lead frame 12 having adhesive 40applied to the attaching surfaces 26 thereof.

Referring to drawing FIG. 4, a semiconductor device 34 is illustratedhaving the active surface 35 thereof secured to the attaching surfaces26 of the lead fingers 14 of a lead frame 12 (not shown) by the adhesive40 located therebetween. As previously stated, the adhesive 40 may beapplied to either the active surface 35 of the semiconductor device 34or the attaching surfaces 26 of the lead fingers 14 of a lead frame 12.The lead fingers 14 and the semiconductor device 34 are pressed intocontact with the adhesive 40, which is subsequently cured. Alsoillustrated, wire bonds 100 extend between and electrically connect thelead fingers 14 with the bond pads 36 on the active surface 35 of thesemiconductor device 34.

The adhesives 40 and 68 are non-conductive polymers selected from thatgroup or class of adhesives that is tacky and compliant at roomtemperature and is at the same time applicable at room temperature to asubstrate through a stencil such as stencil 62. The adhesives 40 and 68preferably have a first copolymer that is from the group of copolymersthat includes isobutyl compounds and is specifically isobutyl acetaldiphenol copolymer. The adhesive also contains a second material whichis from a group of metal oxides that includes titanium dioxide. Thepreferred adhesive has from about 75 percent by weight or volume toabout 95 percent by weight or volume of isobutyl acetal diphenolcopolymer and, respectively, from about 25 percent to about 5 percent byweight or volume of titanium dioxide. The amounts of the twoconstituents may vary somewhat from those stated so long as theresulting composition has the requisite tackiness and compliancy to besuitable to secure a semiconductor device and a lead frame at roomtemperature.

A suitable adhesive is available from International MicroelectronicsResearch Corporation of Nampa, Id. under the product designationEXP/NCBP-4143-33 and is also known as NON-CONDUCTIVE BUMP POLYMER4243-33 (hereinafter referred to as the BUMP POLYMER). The BUMP POLYMERis particularly suitable because it may be applied at or near roomtemperature so that assembly can be effected at room temperature. Roomtemperature is generally deemed to be between 60° Fahrenheit (F.) and85° F. and may range from as low as 50° F. to as high as 95° F.

To manufacture the desired semiconductor devices, the user provides thenecessary lead frames in frame-by-frame sequence. Each lead frame has anattaching surface and connectors associated therewith. Semiconductordevices are also provided in a piece-by-piece sequence, each to beattached to an appropriate lead frame. Each semiconductor device hasbond pads thereon configured for electrical connection to the leadfingers of its respective lead frame.

A non-conductive polymer adhesive from the group that is tacky andcompliant at room temperature and is applicable through a stencil isselected and applied at room temperature to one of the semiconductordevice and the attaching surface of the lead frame and preferably theattaching surface. The semiconductor device and the attaching surfaceare urged together to effect a desired connection between the activesurface of the semiconductor device and the lead frame. Desirably, theadhesive selected is the isobutyl acetal diphenol copolymer withtitanium dioxide as hereinbefore described. In a preferred method, theadhesive is urged through the stencil as it is applied to the attachingsurface of the lead frame or the active surface of the semiconductordevice.

As previously stated, wire bonds are used to form the electricalconnections between the ends of the lead fingers of the lead frame andthe bond pads on the active surface of the semiconductor device.

Those skilled in the art will appreciate that modifications may be madeto the illustrated embodiment and the disclosed methods withoutdeparting from the spirit or principles of the invention and are notintended to limit the scope of the following claims.

What is claimed is:
 1. A semiconductor device assembly comprising: alead frame having a plurality of lead fingers thereon, at least one leadfinger of said plurality of lead fingers having an attaching surface; asemiconductor device having an active surface having at least one bondpad thereon; and a non-conductive polymer adhesive comprising acopolymer material selected from a group of isobutyl compounds, a firstportion of said non-conductive polymer adhesive including isobutylacetal diphenol copolymer, said non-conductive polymer adhesive beingcharacteristically tacky and compliant at a room temperature in a rangeof about 50° F. to 95° F., said non-conductive polymer adhesive appliedto one of said attaching surface of said at least one lead finger ofsaid plurality of lead fingers of said lead frame and a portion of saidactive surface of said semiconductor device for compression therebetweento connect said at least one bond pad of said semiconductor device tosaid at least one lead finger of said plurality of lead fingers of saidlead frame.
 2. The semiconductor device assembly of claim 1, whereinsaid first portion of said non-conductive polymer adhesive consists ofisobutyl acetal diphenol copolymer.
 3. The semiconductor device assemblyof claim 1, wherein said non-conductive polymer adhesive includes afirst material chosen from a group of copolymers that includes isobutylacetal diphenol copolymer and a second material that is from a group ofmetal oxides that includes titanium dioxide.
 4. The semiconductor deviceassembly of claim 3, wherein said non-conductive polymer adhesive hasfrom about 75 percent to about 95 percent by weight of isobutyl acetaldiphenol copolymer and from about 25 percent to about 5 percent byweight, respectively, of titanium dioxide.
 5. A semiconductor deviceassembly comprising: a lead frame having a plurality of lead fingersthereon, each lead finger of said plurality of lead fingers having anattaching surface; a semiconductor device having an active surfacehaving bond pads thereon; and a non-conductive polymer adhesivecomprising a copolymer material selected from a group of isobutylcompounds, said non-conductive polymer adhesive comprising from about 75percent to about 95 percent by weight of isobutyl acetal diphenolcopolymer and from about 25 percent to about 5 percent by weight,respectively, of titanium dioxide, said non-conductive polymer adhesivebeing characteristically tacky and compliant at a room temperature in arange of about 50° F. to 95° F. and is applicable to a substrate througha stencil, said non-conductive polymer adhesive being applied to saidattaching surface of said plurality of lead fingers of said lead frameand a portion of said active surface of said semiconductor device forcompression therebetween to connect said bond pads of said semiconductordevice to said plurality of lead fingers of said lead frame.
 6. Thesemiconductor device assembly of claim 5, wherein a first portion ofsaid non-conductive polymer adhesive is isobutyl acetal diphenolcopolymer.
 7. The semiconductor device assembly of claim 5, wherein saidnon-conductive polymer adhesive includes a first material chosen from agroup of copolymers that includes isobutyl acetal diphenol copolymer anda second material that is from a group of metal oxides that includestitanium dioxide.
 8. The semiconductor device assembly of claim 7,wherein said non-conductive polymer adhesive consists of from about 75percent to about 95 percent by weight of isobutyl acetal diphenolcopolymer and from about 25 percent to about 5 percent by weight,respectively, of titanium dioxide.
 9. A semiconductor device assemblycomprising: a lead frame having a plurality of lead fingers havingattaching surfaces thereon; a semiconductor die having an active surfacehaving a plurality of bond pads thereon; and a non-conductive polymeradhesive which includes a first material chosen from a group ofcopolymers that includes isobutyl acetal diphenol copolymer and a secondmaterial that is from a group of metal oxides that includes titaniumdioxide, said non-conductive polymer adhesive being applied at atemperature in a range of about 50° F. to 95° F. to one of saidattaching surfaces of said plurality of lead fingers and a portion ofsaid active surface of said semiconductor die for compressiontherebetween to connect said semiconductor die to said at least two leadfingers of said plurality of lead fingers of said lead frame.
 10. Asemiconductor device comprising: a lead frame having an attachingsurface thereon; a semiconductor die having a plurality of bond pads onan active surface thereof; and an adhesive that includes from about 75percent to about 95 percent of isobutyl acetal diphenol copolymer andfrom about 25 percent to about 5 percent, respectively, of titaniumdioxide, said adhesive being applied at a temperature in a range ofabout 50° F. to 95° F. to at least a portion of said attaching surfaceof said lead frame and a portion of said active surface of saidsemiconductor die for compression therebetween.
 11. A semiconductordevice assembly comprising: a lead frame having a plurality of leadfingers thereon, each lead finger of said plurality of lead fingershaving an attaching surface thereon; a semiconductor die having anactive surface having a plurality of bond pads thereon; and anon-conductive polymer adhesive which includes a first material chosenfrom a group of copolymers that includes isobutyl acetal diphenolcopolymer and a second material that is from a group of metal oxidesthat includes titanium dioxide, said non-conductive polymer adhesivebeing applied at a temperature in a range of about 50° F. to 95° F. toportions of said attaching surfaces of said lead fingers of saidplurality of lead fingers and to a portion of said active surface ofsaid semiconductor die for compression therebetween to connect saidactive surface of said semiconductor die to said attaching surfaces ofsaid plurality of lead fingers of said lead frame.
 12. A semiconductordevice comprising: a lead frame having an attaching surface; asemiconductor die having bond pads on an active surface thereof; and anadhesive that includes from about 75 percent to about 95 percent ofisobutyl acetal diphenol copolymer and from about 25 percent to about 5percent, respectively, of titanium dioxide, said adhesive being appliedat a temperature in a range of about 50° F. to 95° F. to portions of atleast two of said attaching surfaces of said lead frame and a portion ofsaid active surface of said semiconductor die for compressiontherebetween.